| 摘要 |
PURPOSE: To surely remove unnecessary resin attaching to a lead frame by holding a lead frame at a position wherein a through hole thereof corresponds to a groove part of a connection path and receiving molten resin leaking out to a connection path inside a groove part. CONSTITUTION: A lead frame 1 with a through hole 1a is held by upper and lower molds 3, 2 and a cavity 8 shaped in a fitting surface of the upper and lower molds 3, 4 is filled with molten resin. Simultaneously, air inside the cavity 8 it communicates with an outside of the upper and lower molds 3, 2 and is exhausted to an outside of the upper and lower molds 2, 3 through a communication path 9 with a groove part 10 whose corner part is chamfered in a side near the cavity 8 and a resin mold part is formed covering a semiconductor chip on the lead frame 1. In such a resin mold method of an electronic component, the lead frame 1 is held by the upper and lower molds 3, 2 at a position wherein the through hole 1a corresponds to the groove part 10 of the communication path 9 and molten resin leaking out to the communication path 9 is received inside the groove part 10 in the state. |
