| 摘要 |
PURPOSE: To cut a time required for resin sealing, improving reliability of quality and enlarge a selection range of resin by adopting a method such as to forcibly suck and fill liquid sealing resin supplied around a flip chip in a gap between the flip chip and a substrate on vacuum inside the gap. CONSTITUTION: After a flip chip is mounted on a substrate through a bump, liquid sealing resin is filled into a gap 5 between a substrate and a flip chip and an electronic component is manufactured. In the process, after a circumference of the gap 5 is sealed by liquid sealing resin supplied around a flip chip, it is placed under a depressurized condition. Thereby, air in the gap 5 and in sealing resin is sucked and exhausted to an outside while keeping it sealed by sealing resin and an interior of the clearance 5 is evacuated simultaneously. Thereafter, sealing resin is forcibly sucked and filled into the clearance 5 based on vacuum in the gap 5 by releasing decompression. For example, viscosity of liquid sealing resin is made within a range of 10 to 10000 voids. |
