发明名称 |
HIGH SPEED PHOTO DIODE MODULE |
摘要 |
The method for manufacturing high speed photo diode module comprises the steps of: connecting an Au line to a portion by die bonding ofsoldering a photo diode(PD;14) on a ceramic sub-mount(13) and soldering the sub-mount(13) inside a PD base(26); attaching a hybrid substrate(12) in a metal case(11) for module and fixing an external terminal pin(23) using a teflon ring; inserting a GRIN rod lens(18), a spacer(19) and a fiber ferrule(20) into a fiber ferrule housing(17) in sequence after inserting the optical fiber(21) into the fiber ferrule(20); aligning for a light to be incident into the photo diode(14); forming a sub-module; and wire-bonding of the sub-mount(13) and a pre-amplifier. |
申请公布号 |
KR960013958(B1) |
申请公布日期 |
1996.10.10 |
申请号 |
KR19930027622 |
申请日期 |
1993.12.14 |
申请人 |
KOREA ELECTRONICS & TELECOMMUNICATIONS RESEARCH INSTITUTE;KOREA TELECOM CORP. |
发明人 |
KANG, SEUNG-KOO;SONG, MIN-KYU;PARK, KYUNG-HYUN;YUN, HYUNG-JIN |
分类号 |
H04B10/60;(IPC1-7):H04B10/12 |
主分类号 |
H04B10/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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