发明名称 HIGH SPEED PHOTO DIODE MODULE
摘要 The method for manufacturing high speed photo diode module comprises the steps of: connecting an Au line to a portion by die bonding ofsoldering a photo diode(PD;14) on a ceramic sub-mount(13) and soldering the sub-mount(13) inside a PD base(26); attaching a hybrid substrate(12) in a metal case(11) for module and fixing an external terminal pin(23) using a teflon ring; inserting a GRIN rod lens(18), a spacer(19) and a fiber ferrule(20) into a fiber ferrule housing(17) in sequence after inserting the optical fiber(21) into the fiber ferrule(20); aligning for a light to be incident into the photo diode(14); forming a sub-module; and wire-bonding of the sub-mount(13) and a pre-amplifier.
申请公布号 KR960013958(B1) 申请公布日期 1996.10.10
申请号 KR19930027622 申请日期 1993.12.14
申请人 KOREA ELECTRONICS & TELECOMMUNICATIONS RESEARCH INSTITUTE;KOREA TELECOM CORP. 发明人 KANG, SEUNG-KOO;SONG, MIN-KYU;PARK, KYUNG-HYUN;YUN, HYUNG-JIN
分类号 H04B10/60;(IPC1-7):H04B10/12 主分类号 H04B10/60
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