METHOD OF COATING A THIN FILM ON A SUBSTRATE

摘要

The method for coating a substrate (12) with a relatively thin, uniform film of a fluid (20) with a minimum of waste. A volume of fluid is produced and the size and velocity of the volume of fluid are selected such that the volumes of the fluid break upon impact (24) with the substrate without splashing or rippling. The apparatus and method are ideal for coating semiconductor wafers with a photoresist solution. The kenetic energy of the volume of fluid is adjusted to overcome the free energy associated with the surface tension on impact. The collision of the fluid thus results in a uniform, thin coating of photoresist or other coating solution which may then be further processed by conventional techniques.