MANUFACTURE OF SHALLOW JUNCTION SEMICONDUCTOR DEVICE

摘要

forming a field oxide film(2), a gate oxide film(4), a polysilicon gate(3), a side wall spacer(5), and a source/drain junction(6) on a silicon substrate(1); evaporating a polysilicon film(7) in a finite thickness on a surface of wafer; crystallizing the polysilicon film(7) by a heat treatment; removing all remains except for a photoresistor(8-1); removing all remains except for a silicon layer(7-1) by the etch-back; injecting an impurity into the source/drain region; forming source/drain junction(9); performing a heat treatment.