Verfahren zur Herstellung eines wärmeleitenden Mischmaterial

摘要

A heat-conductive composite material usable as a substrate (heat sink) for mounting a semiconductor thereon or a lead frame is provided, which comprises a core sheet (14) and metal foil layers (16) welded to the both surfaces of the core sheet. The core sheet (14) is composed of a metal sheet (11) of high thermal expansion sandwiched between two metal sheets (12) of low thermal expansion each having a number of through-holes (13) in the direction of the thickness, and the three layers (12,11,12) are laminated and integrated so that a part of the metal sheet (11) of high thermal expansion is exposed out to the metal surfaces of low thermal expansion through the through-holes (13) of the metal sheets (12) of low thermal expansion.