WATER-BASE PHOTOSENSITIVE RESIN COMPOSITION

摘要

A water-base photosensitive resin composition which has satisfactory resist properties equal or superior to those of solvent-base photosensitive resin compositions currently in commercial use and is developable with a dilute aqueous alkali solution. The composition comprises as the essential components: (a) an aqueous emulsion of a polymeric compound containing carboxyl groups; (b) a compound having a photopolymerizable ethylenically unsaturated bond; and (c) a photopolymerization initiator capable of generating free radicals upon exposure to actinic light, the component (a) having a weight average molecular weight in the range of from 1,000 to 50,000, an acid value in the range of from 40 to 140 mg-KOH/g, and a glass transition temperature in the range of from 50 to 200 DEG C.