PACKAGE OF ELECTRONIC DEVICE

摘要

To provide an electronic device having a high density packaging of semiconductor devices, the package includes electronic components and a ceramic multi-layered wiring board equipped with a component mounting surface having terminals, and having the electronic components mounted thereto, wherein the ceramic multi-layered wiring board has terminals on the side surface thereof, too. A package includes a first board equipped with a component mounting surface having terminals and a second board having terminals for connection on one of the surface sides thereof and packaging terminals for establishing conduction with the connecting terminals on the other surface side thereof, wherein the first board is bonded at least mechanically to the second board perpendicularly to the surface side, equipped with the connecting terminals, of the second board. In this way, an electronic device having a high packaging density of semiconductor devices can be obtained.