| 摘要 |
<p>There is provided a metallic component (20) for an electronic package (40). The component (20) is coated with an electrically non-conductive layer (24) and has a plurality of conductive circuit traces (26) on a surface. The circuit traces (26) are soldered (34) directly to the input/output pads (18) of an integrated circuit device (10) and to a second plurality of circuit traces (50). The component (20) may include a heat sink to enhance dissipation of heat from the encapsulated integrated circuit device (10).</p> |
