Mfg. method for multilayer circuit boards e.g. for entertainment electronics

摘要

A multilayer circuit board is produced with a metal carrier (5) with a foil (6) onto which is etched a conductor track (1). A second track is to be formed (2) that crosses over the first without any contact occurring with the first. This is achieved by covering the crossover region with a layer of insulation (3). The circuit track (2) can be formed as a capacitor and can be coupled to a surface mounted resistor (4). Further circuit tracks (7,8) can be formed.