INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING A WINDOW AND METHODS OF MANUFACTURING

摘要

An integrated circuit package assembly is disclosed herein. The assembly includes a leadframe (52) having a plurality of leadframe leads (60). A light responsive semiconductor die (72) is supported on the leadframe. A package is molded directly onto a portion of the leadframe to define an opening integral with the package for a light receiving window (78) through which the semiconductor die may be illuminated by a preselectable light source. In a first method of the invention, the package is molded to the leadframe in two separate sections with the window opening defined in one of the sections during molding. In a second method of the invention, the package is molded to the leadframe in one operation to define the window opening. In both methods the semiconductor die is bonded to the leadframe and electrically interconnected to the leadframe leads through the window opening in the package. The window opening is sealed by a suitable light transmitting material to comprise a light receiving window.