Method of forming antenna structure for inserting into chip-card

摘要

The figure given shows a multi-layer arrangement consisting of four layers or levels (1a to 1d), with the lowest (1a) supported on plastic foil. The conductor path (3a) is formed from conducting silver or some similar material of low resistance by the silk screen printing process and fitted on the plastic foil so that there is a coil (L1) with a first (2a) and a second (2b) terminal. The other conductor paths (3b,3c,3d) and the other coils (L2,L3,L4) are shown. By the same silk screen process, there is formed on the lowest layer a first insulation layer (1b), with cutouts (4a,4b) and, then a conductor path (3b), with a coil (L2) and a first (2c) and a second (2d) terminal.