| 摘要 |
The present invention relates to a packaging damper for electronic components and devices, especially for printed circuit boards, said packaging damper comprising a pad section (1), which consists of an envelope (1a) manufactured of wood fibre material and of shredded wood fibre material (1b) provided inside the envelope; and a corrugated board sheet (2) manufactured of wood fibre material, attached on at least one side of the pad section. |
