| 摘要 |
PURPOSE: To provide a processing device enhanced in throughput, wherein various processing for transferred wafers can be selected or changed according to need, and works can be centered or aligned while being transferred. CONSTITUTION: Wafers WB are taken out from a housing cassette 122 provided to a loading/unloading mechanism 120 by a transfer mechanism tweezers 121 and successively or selectively and separately or exclusively set or reset to various processing stations 103 to 108 provided on each lateral side of a transfer route 102 as being thermally insulated through the intermediary of the pairs of support device tweezers 112 and 113 of a hold/transfer mechanism 110. At this point, the tweezers are freely displaceable in the directions of X, Y, and Z and the angleθof rotation to take out works from a cassette by the tweezers and deliver them to one pair of tweezers provided to a hold/transfer mechanism through the intermediary of an interface mechanism provided adjacent to a loading/unloading mechanism, the works are centered and aligned while being transferred, assembled, and reassembled in optimal position, whereby products can be processed without being deteriorated, deformed, and contaminated with dust. |
