| 摘要 |
<p>PURPOSE: To thin a thickness of an IC card which uses a microstrip antenna by arranging an IC chip at an opening of a spacer and connecting a pump of the IC chip and a circuit pattern electrically. CONSTITUTION: An IC card 100 comprises a substrate 1 having a circuit pattern 2 and an antenna pattern 3 as a receiving function formed on its top face 1a, an opening 12, and a through hole 6. On a top face 4a, an insulating spacer 4 having an earth pattern 5, an opening 12 which is the same as the spacer 4, and the through hole 6 are arranged. The top face 1a of the substrate 1 and a bottom face 4b of the spacer 4 are joined by an adhesive sheet 11. A pump 8 of an IC chip 7 is attached with pressure to the circuit pattern 2 through an anisotropic conductive adhesive 9 so as to electrically connect the pump 8 and the circuit pattern 2. Also, the antenna pattern 3 and the earth pattern 5 are connected electrically by the through hole 6.</p> |
