| 摘要 |
<p>PURPOSE: To provide chip-electronic components used for a high-density wiring circuit whose deflection strength is improved even when the components are mounted on a printed circuit board. CONSTITUTION: In electronic components where an external electrode is deposited and formed on one surface or a plurality of surfaces of the chip- electronic component, a side surface electrode layer 3 as the external electrode whose main constituent is a conductive metal particle, a nickel plated layer 7 for completely covering the side surface electrode layer 3 and a high- temperature solder layer 5 which is a plastic metal layer for completely covering the nickel plated layer 7, and a plated layer 8 for completely covering the high-temperature solder layer 5 are provided, thus improving the deflection strength with the high-temperature solder layer 5.</p> |
