| 摘要 |
<p>PURPOSE: To obtain the subject composition, excellent in rigidity, dimensional stability and antistatic properties and useful as a carrier, etc., for processing and treating semiconductor wafers by blending a polyether ketone resin with specific amounts of a liquid crystal polyester and specified carbon fibers. CONSTITUTION: This resin composition is obtained by blending (A) 100 pts. wt. composition comprising (1) 95-50wt.% polyether ketone resin of preferably formula I [(n) is the average repetitive number] and (ii) 5-50wt.% liquid crystal polyester containing a recurring unit of preferably formula II, in a sum amount of at least 30mol% based on the whole, with (B) 5-100 pts.wt. carbon fibers having 5-20μm average fiber diameter and 30-500μm average fiber length. Furthermore, the surface resistivity of a molding prepared from the composition is preferably 10<12> to 10<12>Ω. The component (i) preferably has 500-3800 P melt viscosity (apparent melt viscosity when extruding the resin heated at 400 deg.C from a nozzle having 1mm inside diameter and 10mm length under 1000sec<-1> shearing rate).</p> |
