| 发明名称 |
Circuit connection in an electrical assembly |
| 摘要 |
An electrical assembly comprises an electrical component having an array of contact bumps. The component is mounted on a multilayer printed circuit board having a plurality of conducting pins located in holes in the board and having pointed ends projecting above the board and making electrical contact with the bumps on the component.
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| 申请公布号 |
US5561594(A) |
申请公布日期 |
1996.10.01 |
| 申请号 |
US19950371802 |
申请日期 |
1995.01.11 |
| 申请人 |
SGS-THOMSON MICROELECTRONICS LTD. |
发明人 |
WAKEFIELD, ELWYN P. M. |
| 分类号 |
H01R4/24;H01L23/488;H01L23/498;H01R11/01;H01R12/04;H01R12/16;H01R12/32;H01R13/24;H01R33/76;H05K1/18;H05K3/32;H05K7/10;(IPC1-7):H05K7/02;H01R9/00;H01R43/04 |
主分类号 |
H01R4/24 |
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