发明名称 PRESSURE-SENSITIVE ADHESIVE COMPOSITION
摘要 PURPOSE: To obtain a pressure-sensitive adhesive composition which can decrease in its peeling force by heating without forming combustible gases, etc., in a sage working environment by dispersing a specified inorganic salt in a pressure- sensitive adhesive component. CONSTITUTION: A pressure-sensitive adhesive composition is prepared by dispersing 0.5-200 pts.wt. inorganic salt particles of a mean particle diameter of 0.5-100μm and water of crystallization which can be removed at 50-150 deg.C. The composition may comprises a pressure-sensitive adhesive base and a tackifier. This base may further contain a plasticizer, a cross-linking agent and a filler. The amount of the tackifier added is desirably 1-70 pts.wt. per 100 pts.wt. above base. Examples of the inorganic salts include FeSo4 .7H2 O and Na2 S2 O3 .5H2 O.
申请公布号 JPH08253746(A) 申请公布日期 1996.10.01
申请号 JP19950059175 申请日期 1995.03.17
申请人 SEKISUI CHEM CO LTD 发明人 MIYASHITA HIROSHI
分类号 C09J11/04;C09J201/00;(IPC1-7):C09J11/04 主分类号 C09J11/04
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