| 摘要 |
<p>PURPOSE: To provide a cooling system which is used for various electronic packages used in an electronic equipment, especially capable of efficiently cooling a highly-dense electronic package used in an electronic equipment, and limits less the freedom of design for an electronic equipment. CONSTITUTION: A cooling system is equipped with a heat radiator 40 installed in a separate housing site previously prepared inside the case of an electronic equipment, a heat transfer plate element 36 provided so as to receive heat from a electronic package in the case, and a heat conduction path element 38 provided between the heat transfer plate element 36 and the heat radiator to transmit heat.</p> |
