| 摘要 |
<p>PURPOSE: To obtain a multilayer printed-wiring board by which the density of a mount component can be made high and by which the density of a printed- wiring conductor can be made high by a method wherein a surface-layer component mounting pad on a surface-layer printed-wiring conductor is brought into direct continuity with an inner-layer component mounting pad at an adjacent inner-layer printed-wiring conductor via a thermosetting insulating resin. CONSTITUTION: An inner-layer printed-wiring conductor 11 and an inner-layer component mounting pad 23 are formed integrally, and a surface-layer component mounting pad 16 is brought into continuity with the inner-layer component mounting pad 23 and with the inner-layer printed wiring conductor 11. In addition, an empty space 24 is formed in the part of a surface-layer printed-wiring conductor, and a surface printed-wiring conductor 25 can be added. The surface printed-wiring conductor 25 can be used in the same manner as the surface-layer component mounting pad 16 or as another surface-layer component mounting pad, and it can be used as a surface printed-wiring conductor having another continuity partner. Thereby, the density of a mounting component can be made high, a multilayer printed-wiring board can be made small and low-cost, a wiring distance can be shortened, and a noise can be reduced.</p> |
