发明名称 LEAD FRAME, RESIN SEALED SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF, AND MOLDING DIE
摘要 PURPOSE: To minimize increase in the number of manufacturing steps and manufacturing cost of a lead frame while simplifying the process and shortening the processing time by molding a die pad, a plurality of leads, at least two support bars, tie bars and the frame integrally. CONSTITUTION: The lead frame 10 comprises a frame 5, a plurality of leads 1, tie bars 2 for supporting the lead 1, a tie pad 3, and support bars 4 extending in parallel with the lead 1 while supporting the die pad 3 molded integrally. The lead frame 10 can be machined to have a level difference of about 510μm between the lead 1 and the die pad 3 by bending the support bar 4 at two points A, B by means of a press in the manufacturing stage and deforming the support bar 4 into a predetermined shape.
申请公布号 JPH08255862(A) 申请公布日期 1996.10.01
申请号 JP19950294286 申请日期 1995.11.13
申请人 SHARP CORP 发明人 AOKI KAZUMA
分类号 H01L23/50;H01L21/56;H01L23/495 主分类号 H01L23/50
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