| 摘要 |
PURPOSE: To quickly and surely perform suction and alignment of a plurality of solder chips in one process by a method wherein a suction means provided with a plurality of suction parts is brought into close contact with, and coupled to, the opening part of a container housing the plurality of solder chips, it is reversed at a prescribed angle and the solder chips are sucked and held by the respective suction parts and fed to the prescribed position of an electronic component. CONSTITUTION: A mounting head 80 provided with a plurality of suction parts 220 is coupled, in a close contact state, to the opening part of a container 12 housing a plurality of solder chips 204, it is turned around the central shaft I 190 to 210 deg. by keeping the state, and the solder chips 204 are sucked to the suction holes 220 in the mounting head 80. Then, a rotating cylinder is reversed, and the surplus chips 204 are returned to the container 12. In this state, the coupling claw 18 of a coupling claw cylinder 20 is set to an open state when a vacuum pressure sensor indicates a negative pressure, and the mounting head 80 is raised to move up to a mounting station. thereby, the suction and the alignment operation of the solder chips can be performed quickly and surely in one process. |
