| 摘要 |
PURPOSE: To obtain the subject composition, comprising a specific polyimide siloxane and an epoxy resin, excellent in heat and solder flux resistances, adhesion and storage stability and suitable as a printing ink, a coating varnish, etc., capable of forming a protecting film on a flexible wiring board. CONSTITUTION: This composition comprises (A) 100 pts.wt. polyimide siloxane, having a structure of formula I [R1 is a tetravalent residue after removing a carboxylic acid from an aromatic tetracarboxylic acid; R2 is a bivalent residue (Z1 ) after removing NH2 from a compound of formula II [R5 is a bivalent hydrocarbon group, etc.; R6 is a 1-3C alkyl, etc.; n1 is 3-30], a bivalent residue (Z2 ) after removing NH3 from a compound of formula III (X is a direct bond, O, etc.;γ1 is OH, etc.; n2 is 1 or 2; n3 is 0-3) and a bivalent residue (Z3) after removing NH2 from other diamines; m1 is the number of structural units] in which m1 , m2 and m3 are each the number of structural units containg Z1 , Z2 and Z3 and (B) 1-50 pts.wt. epoxy resin. The component (A) is soluble in organic solvents and has >=0.16 inherent viscosity. The respective ratios of m1 , m2 and m3 in which R2 is Z1 , Z2 and Z3 in the polymer are 45-80mol%, 0.5-40mol% and the balance based on 100mol% sum total.
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