发明名称 Compositions for protecting semiconductor elements and semiconductor devices
摘要 Curable silicone compositions comprise either (a) microparticles of a fluororesin which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin. The compositions are useful coatings for semiconductor devices requiring high levels of moisture and heat resistance.
申请公布号 US5561329(A) 申请公布日期 1996.10.01
申请号 US19950452760 申请日期 1995.05.30
申请人 DOW CORNING TORAY SILICONE CO., LTD. 发明人 MINE, KATSUTOSHI;NAITO, HIROYOSHI;YAMAKAWA, KIMIO
分类号 C08K9/04;C08K9/10;C08L27/12;C08L83/04;C08L87/00;H01L23/29;H01L23/31;(IPC1-7):H01L23/29 主分类号 C08K9/04
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