Duplexer package

摘要

A multilayer duplexer package is provided, which includes: two surface-acoustic-wave filter chips having different center pass band frequencies; and at least two phase matching circuits for matching the phase of one filter chip to that of the other filter chip, said phase matching circuits respectively comprising strip lines stacked one above another, and said strip lines each having a characteristic impedance higher than the characteristic impedance of an external circuit to be connected to the duplexer package.