| 摘要 |
A thick film paste compsn. for forming resistor or thermistor patterns on a substrate comprises by wt. (a) 5-65% ruthenium-based conductive materials and (b) 95-35% of a glass compsn. which is free of lead and cadmium. (a) and (b) are dispersed in an organic medium. The glass contains by mole %, 5-70% Bi2O3, 18-35% SiO2, 0.1-40% CuO, 5-25% ZnO, 0.5-40% CoO, 0.5-40% Fe2O3 and 0.5-40% MnO. Also claimed is a compsn. as identified above where the glass contains by mole %, 0-2% MgO, 0-20% BaO, 0-6% Al2O3, 0-45% B2O3, 0-5% ZrO2, 5-70% Bi2O3, 18-35% SiO2, 0.2-40% CuO, 0-25% ZnO, 0.1-40% CoO, 0.5-40% Fe2O3 and 0.5-40% MnO. |
