发明名称 RESIN COMPOSITION AND MOLDING HAVING IMPROVED HEAT STABILITY
摘要 PURPOSE: To obtain the subject composition excellent in heat stability, rigidity, etc., and useful for a camera, etc., by compounding a composition consisting of a specific thermoplastic resin and a specific inorganic filler in combination with a specific epoxy resin or phenoxy resin and a specific silane coupling agent. CONSTITUTION: This resin composition is obtained by compounding (A) a composition composed of (i) 38-98wt.% of a thermoplastic resin containing at least 50wt.% of an aromatic polycarbonate resin in 100wt.% of a thermoplastic resin and (ii) 1-50wt.% of an inorganic filler (preferably, mica and/or talc) having reactivity with an aromatic polycarbonate resin in combination with (B) 0.1-10wt.% of a resin of at least one kind selected from an aromatic epoxy resin and a phenoxy resin and (C) 0.05-2wt.% of an epoxy silane coupling agent of the formula [R<1> is methyl or ethyl; R<2> is a 1-3C alkyl; R<3> isγ- glycidoxypropyl, etc.; (m+f(n)=3, (m)=1,0, (n)=2,3].
申请公布号 JPH08253667(A) 申请公布日期 1996.10.01
申请号 JP19960004635 申请日期 1996.01.16
申请人 TEIJIN CHEM LTD 发明人 ONO TETSUSHI;INOUE TAKAAKI
分类号 C08J5/00;C08K3/00;C08K3/34;C08K5/54;C08K5/541;C08K5/5419;C08L63/00;C08L69/00;(IPC1-7):C08L69/00 主分类号 C08J5/00
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