发明名称 PROCEDIMIENTO PARA MEJORAR EL COMPORTAMIENTO MECANICO DEL COBRE CHAPADO.
摘要 <p>A method for preparing the surface of copper substrates by anodically dissolving the surface, for a time and depth sufficient to substantially decrease higher local oxygen content of the surface and thereby improve the adhesion of electrodeposited copper coatings. More specifically, the surface pretreatment provides a base for an electrodeposited copper coating with enhanced resistance to blistering and peeling at temperatures in excess of 700 DEG F.</p>
申请公布号 ES394896(A1) 申请公布日期 1974.12.01
申请号 ES19960003948 申请日期 1971.09.08
申请人 USS ENGINEERS AND CONSULTANTS, INC. 发明人
分类号 B22C23/02;C25D5/34;(IPC1-7):23B/ 主分类号 B22C23/02
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