发明名称 |
PROCEDIMIENTO PARA MEJORAR EL COMPORTAMIENTO MECANICO DEL COBRE CHAPADO. |
摘要 |
<p>A method for preparing the surface of copper substrates by anodically dissolving the surface, for a time and depth sufficient to substantially decrease higher local oxygen content of the surface and thereby improve the adhesion of electrodeposited copper coatings. More specifically, the surface pretreatment provides a base for an electrodeposited copper coating with enhanced resistance to blistering and peeling at temperatures in excess of 700 DEG F.</p> |
申请公布号 |
ES394896(A1) |
申请公布日期 |
1974.12.01 |
申请号 |
ES19960003948 |
申请日期 |
1971.09.08 |
申请人 |
USS ENGINEERS AND CONSULTANTS, INC. |
发明人 |
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分类号 |
B22C23/02;C25D5/34;(IPC1-7):23B/ |
主分类号 |
B22C23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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