发明名称 DEVICE CONTAINING WELDING PLOT FORMED ON SUBSTRATE AND PREPARATION OF ITS WELDING PLOT
摘要 PROBLEM TO BE SOLVED: To provide a layer with a shielding layer characteristic and a layer with a wetting characteristic in a welded plot without using difficult technologies for adhering a plurality of layers by providing a specific protection intermediate layer, consisting of an alloy containing a first metal that indicates a shielding layer characteristic for a welded layer and a second metal that indicates a wetting characteristic. SOLUTION: A welded plot 2 that is formed on a substrate 3 and contains a connection lower layer 4, a protection middle layer 5, and a welded layer 6 successively from the substrate 3 is included in a device 1. In such a device 1, the protective middle layer 5 is made of an alloy of at least two types of metals, namely a first metal indicating a shielding layer characteristic for the welded layer 6 and a second metal for indicating a wetting characteristic. Then, the ratio of the first metal in the alloy is gradually decreased to a sufficiently low value, so that the ratio of the second metal becomes sufficiently high for obtaining the wetting characteristic from a sufficiently high value such that the shielding characteristic is obtained in the direction of the welded layer 6. For example, the welded layer 6 is made of a uniform alloy of tin and gold, and the first metal is set to tungsten.
申请公布号 JPH08250554(A) 申请公布日期 1996.09.27
申请号 JP19960016802 申请日期 1996.02.01
申请人 ALCATEL NV 发明人 KURISUCHIYAN BERUE;RORAN KURIO
分类号 B23K35/26;B23K35/00;C23C14/28;H01L21/52;H01L21/60;H01L23/485;H05K3/34 主分类号 B23K35/26
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