| 摘要 |
<p>PURPOSE: To provide a manufacturing method for a thick film circuit board for a microwave band and a millimeter wave band at low cost. CONSTITUTION: A metal mask which has an opening of a predetermined shape formed is arranged on a ceramic substrate 11, a thick film resistance 12 is printed, dried, and treated with firing, a thick film conductor 13 is printed, dried, treated with firing as if overlapping part of the thick film resistance 12, further the thick film conductor 13 is etched, thereby manufacturing the thick circuit board.</p> |
