| 摘要 |
<p>PURPOSE: To make the cavity size of an aperture approximate to the semiconductor size, by printing a wiring pattern on a green sheet, baking a green sheet group, and forming an aperture for inserting a semiconductor element, in a green sheet in which an aperture is not formed. CONSTITUTION: Ceramics powder is compound with glass componentpigment component and organic solvent component, and a green sheet is formed by using a doctor phrase method or the like. After viaholes for wiring or the like are formed by a pressing method or the like, the inner electrode of a package is formed by a screen printing method of conductor paste. After two green sheets are laminated, they are bonded with pressure without forming an aperture for a cavity part 2, and subjected to ceramic baking. After baking, the cavity part 2 for inserting a semiconductor element is formed in the green sheet. A package is formed by soldering outer leads 3 and plating the sheath.</p> |
