| 摘要 |
<p>PURPOSE: To provide a BGA type semiconductor device which can easily be manufactured and its manufacturing method. CONSTITUTION: A semiconductor chip 10 is mounted and bonded on an insulator 9, the insulator 9 is bent and worked, and the extended end part of the insulator 9 is arranged in the vicinity of the side surfaces 4 of the semiconductor chip 10. Wiring patterns 11a-11c are formed on the insulator 9, the semiconductor chip 10 is electrically connected with the wiring patterns 11a-11c through metal thin wires 12. The wiring patterns 11a-11c are continuously formed on the side surfaces and on the bottom of the mounted semiconductor device. Electrode terminals 13 are formed at the tip parts of the wiring patterns 11a-11c of the bottom, and a BGA type semiconductor device is constituted. The region of the semiconductor chip 10 is sealed with plastic resin 14.</p> |
