SEMICONDUCTOR ELEMENT MOUNTING SIBSTRATE AND MANUFACTURE THEREOF

摘要

PURPOSE: To provide a semiconductor element mounting substrate which has an excellent connection reliability between a semiconductor element and external electrodes and also provide a method for manufacturing it. CONSTITUTION: A semiconductor element mounting substrate S is constituted of a laminate which is built up with an insulating film 2 and a heat adhesive resin layer 4 and has at least one through hole 5 in the thickness direction. A lead 3 is formed at an opening on the insulating film 2 side of the laminate. The through hole where the lead 3 is formed is filled with conductive material and therefore a conduction path 6 is formed in the through hole. At an opening of the through hole on the thermocompression bonding resin layer 4 side, a connection terminal 7 for electrical connection with an outer electrode of the semiconductor element is formed at the same level with or projecting from the surface of the thermocompression bonding resin layer 4. In the manufacture of this semiconductor element mounting substrate, a process wherein the connection terminal is formed is conducted after a process where the insulating film and the thermocompression bonding resin layer are stacked into a laminate.