发明名称 MMIC PACKAGE ASSEMBLY
摘要 PURPOSE: To prevent an undesired high frequency signal from entering a package or from being emitted to the outside of the package by coupling the inside of the package, an antenna element and a transmission line with each other electromagnetically through the use of slot coupling. CONSTITUTION: A planar antenna 41e or a high frequency signal transmission line are formed to the rear side (outer lower face) of a package 3 containing an MMIC(monolithic microwave integrated circuit) 2 in an enclosing way and a ground conductor 41c provided with a rectangular slot section 41d is formed to the package 3. A microstrip line 2f is provided to the surface of the MMIC 2. The lengthwise direction of the slot section 41d is made orthogonal to the lengthwise direction of the microstrip line 2f. A high frequency signal is transmitted by electromagnetic coupling a planar antenna 41e or a high frequency signal transmission line with the microstrip line 2f via the slot section 41d.
申请公布号 JPH08250913(A) 申请公布日期 1996.09.27
申请号 JP19950056132 申请日期 1995.03.15
申请人 HONDA MOTOR CO LTD 发明人 SHINGYOUCHI MASAHITO
分类号 H01L23/04;G01S7/03;H01L23/02;H01L23/64;H01P5/08;H01Q13/08 主分类号 H01L23/04
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