| 摘要 |
An optical semiconductor device including one of a light responsive semiconductor element, a light emitting semiconductor element, and a light responsive and light emitting semiconductor element, and a package hermetically sealing the semiconductor element. The package includes a window of silicon that selectively transmits light incident on the semiconductor element and emitted from the semiconductor element. The Si window is connected to the package body using a solder that makes a eutectic alloy with silicon. In this structure, since the eutectic alloy is produced at the junction of the Si window and the package body, the junction is not adversely affected by external influences, especially temperature. Further, since the Si window does not transmit light in the visible light region, the inside of the package cannot be seen from the outside through the Si window after fabrication of the device. Therefore, a completed device is not judged as a defective only from an abnormal appearance, whereby the production yield is improved. Further, since the Si window is produced using a conventional Si wafer and an apparatus used in a conventional wafer processing of semiconductor devices, the Si window is produced in a relatively simple process and at low cost. |
