发明名称 FLOOR MATERIAL FOR WIRING
摘要 <p>PURPOSE: To prevent the blocking of a wiring pit due to a wiring parts and to easily connect wirings on a floor to the wiring parts by incorporating the wiring parts in a space between double floors. CONSTITUTION: Wiring floor blocks 2 having top plates 2a, supporting legs 2b and ribs 2c are disposed at a predetermined interval to form a wiring pit, and a lead-in space 2f opened above to lead in wires 3 from above the floor and a containing space 2e for containing a wiring parts 4 are provided at the block 2. The space 2e of the block 2 is so provided adjacently to the space 2f as to contain the parts 4 in the state opposed to the space 2f to communicate with the pit. Further, the space 2f is blocked openably upward via a reinforcing plate 6a and the cutout 7a of a partition plate 7 placed at the step 2h of the peripheral edge.</p>
申请公布号 JPH08251778(A) 申请公布日期 1996.09.27
申请号 JP19950045745 申请日期 1995.03.06
申请人 MIRAI IND CO LTD 发明人 SHIMIZU SHOHACHI
分类号 H02G1/06;H02G3/38;(IPC1-7):H02G3/28 主分类号 H02G1/06
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