| 摘要 |
PURPOSE: To provide the manufacturing method of a semiconductor device, whose resin sealing work is easy, by using resin-based sealing material in the solid state at ordinary temperature having the excellent moisture-resistance reliability. CONSTITUTION: The electrode part of a semiconductor element 5 is brought into contact with the wiring electrode of a substrate 2 through solder 4 and mounted. Then, a solid-state sealing resin composition (A) at ordinary temperature is mounted on the mounting surface of an element 5 of the substrate 2 and heated and fused. The sealing resin composition in the fused state is filled and hardened in the space between the substrate 2 and the semiconductor element 5, and a sealing resin layer 6 is formed in the space between the substrate 2 and the semiconductor element. (A) is the sealing resin composition, wherein the following components (a)-(c) are contained, and the containing rate of the (c) component is set in the range of 50-90wt.% of the entire sealing resin composition. The component (a) is epoxy resin,the component (b) is novolak resin and the component (c) is silica powder, whose maximum particle diameter is set at 30μm or less. |
