| 摘要 |
PROBLEM TO BE SOLVED: To reduce light loss of a connecting part caused when light passes through plural wave guides having different optical parameters by specifying the lateral containment coefficient and width of the respective points along the length of a wave guide. SOLUTION: A substrate 2 comprises a semiconductor chip formed by a bottom containment layer CB and a top containment layer CS which are extended in the horizontally longitudinal direction DZ and lateral direction DX and superposed one on the other in the vertical direction DY, wherein high refractive index layers GL, GM are included between both containment layers CB, CS. A wave guide includes monolithic rear parts SL, ST and a front segment SM which are extended along the length, connected to each other and bonded each other in a bonding area, and the lateral containment coefficients of the respective points along the length are formed the ratio of light output contained within the width of the wave guide to the total light output. The coefficient and the width of the wave guide are made larger in the rear part than in the front segment near the bonding area. |
