THERMOFORMING THREE-DIMENSIONAL WIRING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a wiring module that can be thermoformed to a desired three-dimensional shape and consists of a plurality of laminated polymer layers containing a specific electronic circuit without damaging an internal wiring in a thermoforming stress region. SOLUTION: A wiring module 1 has a plurality of laminated thermoformable polymer layers and a wiring circuit 3 and a via 2 are formed on the polymer layers. A region D that is bent by thermoforming is formed so that a wiring circuit 4 exists only on the internal polymer layer of a center region B that is not subjected to any stress and distortion on bending.