| 摘要 |
PURPOSE: To eliminate possibilities of stay shift and shortcircuiting with a lead at an edge of a semiconductor element due to flowing of mold resin in a resin sealing method for sealing a semiconductor element by positioning a semiconductor element held by a lead frame inside a cavity of a mold die and injecting resin into the cavity. CONSTITUTION: Resin 12a enough to submerge a rear part of a semiconductor element 1 when a lead frame 4a is set on a lower die 10 is dropped in a cavity 11a of the lower die 10. A lead frame 4a is set on the lower die 10 before the resin is cured. After the resin 12a is cured, mold resin 12b is injected into the cavity 11 by a transfer mold method with an upper die 9 positioned on the lower die 10 for resin sealing. |
