| 摘要 |
PURPOSE: To provide a power module wherein a frame is formed on the substrate surface of an inverter part by using the material to which silicone resin is not bonded, and filled with cold-setting silicone resin to reinforce insulation and resistance to thermal stress. CONSTITUTION: A power element and its peripheral circuit are packaged by using a metal substrate and a ceramic substrate, and are collectively formed as a compound component, thereby obtaining a module. The inverter part 4 shown in figure contains the module. The region of the inverter part which requires insulation and the region to which thermal stress is applied are reinforced by using cold-setting silicone resin. A frame is formed in the part necessitating protection by using the material to which the silicone resin is not bonded, and the silicone resin is poured inside the frame, as far as the narrow part necessitating insulation and small gaps. Since the resin is cured at a normal temperature, the resin is cured as it is without being heated, and serves as a protective case. |
