| 摘要 |
PURPOSE: To provide a semiconductor device the reliability of which is secured at a sufficiently high level by eliminating the inconvenience caused by the difference in coefficient of linear expansion between a semiconductor element and circuit board and which can be improved in packing density by constituting parts into flip chips and can be reduced in manufacturing cost and the manufacturing method of the semiconductor device. CONSTITUTION: In a semiconductor device 10, a plurality of wiring sections 14 which makes a continuity with one of a plurality of pads 12 is formed on the pad forming surface of a semiconductor element 11 provided with the pads 12 and bumps 18 are formed at prescribed positions in the wiring sections 14. A manufacturing method is used for manufacturing the semiconductor device. |
