| 摘要 |
<p>PURPOSE: To divide a semiconductor wafer into chips at a high yield by dicing the semiconductor wafer with a dicing jig having through holes for vacuum chucking in recessed sections or recessed section forming areas or on the outside of the forming areas in an area facing the mobile section or protecting section of semiconductor devices. CONSTITUTION: A discoid semiconductor wafer 1 on which a plurality of semiconductor devices respectively having movable sections or projecting sections are formed in each chip is diced into the semiconductor devices with a dicing jig 2 having a movable section, project protective recessed sections 2a, through holes 2b which become wafer fixing vacuum chucking holes, an O-ring 2c for supporting the wafer 1, an air introducing port 2d, and an air blowing port 2e in accordance with a prescribed process flow. A dicing jig made of a high- rigidity material (metal, ceramic, etc.) is used as the jig 2, but it is suitable to use a ceramic material 'Macol' which can be worked easily is suitable. It is also possible to use a silicon wafer for the jig 2.</p> |
