| 摘要 |
<p>PURPOSE: To provide the connecting part by plating so as to obtain high reliability without physical damages such as heating and pressurization and the like when electric connection is performed in such a way that the interval between the parts that are electrically connected to each other can be shortened than the conventional interval. CONSTITUTION: This device has the following parts. An inner lead 19 comprises conductive material and has the respective tip part. Electrode pads 14 are formed on the surface of a semiconductor chip 11. A metal plated layer 20 electrically connects the each tip part of the inner lead and each electrode pad of the semiconductor chip without using any of physical pressure and heat.</p> |
