| 摘要 |
<p>PURPOSE: To increase the number of electrodes and cope with the multipin configuration of outer connection electrodes, by using side surface outer connection electrodes and rear surface outer connection electrodes, as the respective mutually independent terminals. CONSTITUTION: A semiconductor element 4 is electrically connected with electrode pad parts 7, 8 by using connection means like wires 6. The electrode pad 7 is connected with a side surface outer connection electrode 9. The electrode pad 8 is connected with a rear surface outer connection electrode 10. The semiconductor element 4 on a leadless circuit board 5 and wires 6 are resin-sealed with a sealing body 11. Thereby, the number of electrodes can be increased when the number of wirings of the semiconductor element 4 is large, so that multipin configuration is enabled and super multipin structure can be realized.</p> |
