| 摘要 |
PURPOSE: To make a high frequency circuit device small without losing the performance of the high frequency circuit device. CONSTITUTION: Porous thin film layers 3, 4, 5, 6 are formed on a porous board 2. An IC T is mounted and a micro strip line 8 and a DC line 9 are formed on the surface of the porous thin film layer 6. A ground metallic layer is formed between the porous thin film layers 6, 5 and the porous thin film layers 2, 3. Furthermore, the strip line and the DC line are formed at a prescribed position between the porous thin film layers 4, 5 and between the porous thin film layers 2, 3. |
