| 摘要 |
<p>An integrated circuit assembly (30) is disclosed herein. The assembly includes a dielectric substrate (32) defining a predetermined array of electrically conductive traces (40) and an array of solder balls (42) electrically connected to the traces (40). An integrated circuit chip (44) having a series of input/output pads is supported on the substrate (36). In one embodiment, a plurality of leadframe leads (48) are supported by the substrate (36) in electrical isolation from and over the conductive traces (40). First and second series of bonding wires (56, 58) electrically connect certain ones of the input/output pads on the IC chip (44) to the leadframe leads (48) and conductive traces (40). In other embodiments, one or more electrically isolated conductive layers (142, 144) are supported by the dielectric substrate (122) over the traces (128) and leadframe leads (130). The integrated circuit assembly (120), in accordance with any of these embodiments, provides a very high density electrical interconnection arrangement for the IC chip (132) while retaining a small package footprint.</p> |
