摘要 |
Provided is a semiconductor device comprising a semiconductor chip which is directly covered with a resin material having a light shielding property as well as a film which is provided on the resin material for shielding the semiconductor device against light. The film may be formed by a seal having a surface which is covered with a metal and a rear surface which is colored black, a layer of a metal or ceramics which is deposited in a vapor phase, or a coating of an insulating material whose refractive index is different from that of the resin material. In another aspect of the present invention, provided is a semiconductor device which is directly covered with a resin material mixed with a light absorbing material. In still another aspect of the present invention, provided is a semiconductor device comprising a semiconductor chip, having a surface covered with black polyimide, which is further covered with a resin material having a light shielding property. In a further aspect of the present invention, provided is a package for covering a semiconductor device which is mounted on a wiring board. According to such improvement, a light shielding property is improved particularly in relation to a thin semiconductor device whose thickness is only about 1 mm, and the semiconductor device is prevented from a malfunction caused by light. |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
ISHIKAWA, MASAHIKO, ITAMI, HYOGO, JP;HAYANO, KOHJI, ITAMI, HYOGO, JP;MORI, SHINICHI, ITAMI, HYOGO, JP;YAMASHITA, MASAYUKI, ITAMI, HYOGO, JP;UEDA, OSAMU, ITAMI, HYOGO, JP;MORIGA, NAMIKI, ITAMI, HYOGO, JP |