Pad on pad type contact interconnection technology for electronic apparatus

摘要

A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under permanent compressive force in service. In high density and high performance electronic apparatus interwiring, array quantities of the spring member of contact are fabricated in unitary assembly elements for connection assemblies between both rigid and flexible type wiring.